The invention refers to a device for surface roughening copper plate, and a surface roughened copper plate. To provide a process for roughening both sides of a copper plate by forming a protrusion as a fine bump shape on the both sides of the copper plate. First of all, there is designed to be arranged electrodes (a 3 and another 3 in the representative figure) as a similar pole for therebetween to be opposed to each other in an electroplating solution for plating copper (a 2 therein), and then to be arranged a copper plate (a 4 therein) at therebetween. And then at first there becomes to be performed an anodic treatment for generating a fine particle of copper on both surfaces of the copper plate (4), by performing an electrolytic process with the copper plate (4) as a positive electrode therefor and the electrodes (3) and the other (3) as negative electrodes therefor. And then thereafter there becomes to be performed a cathodic treatment therefor, by performing an electroplating of copper with the copper plate (4) as a negative electrode therefor and the electrodes (3) and the other (3) as positive electrodes therefor, for such the fine particle of copper to be fixed onto the surfaces of the copper plate (4). Furthermore, there becomes to be formed the above mentioned protrusion as the fine bump shape thereon, by performing the anodic treatment therefor and then the cathodic treatment therefor as not less than one cycle thereof.