The invention relates to an electronic component (1) with an integrated protective device (3) which responds in the event of a thermal overload and interrupts a current flow through the component (1). The electronic component (1) is characterized by the fact that the protective device (3) has an electrical terminal (4) which can be brought under spring prestress by intrinsic resilience and assumes a fitted position in the prestressed state and a current interruption position in the unstressed state. The invention furthermore relates to an electrical circuit arrangement (10) and a method for populating a circuit substrate (11).