A method for producing a circuit board involves: a metal electrode forming step of forming, on a retaining sheet, a plurality of metal electrodes spaced from one another by cutting a piece of metal foil retained on the retaining sheet and removing a portion of the metal foil; an adhesive layer forming step of forming an adhesive layer on the surface of the plurality of metal electrodes; a substrate bonding step of bringing the adhesive layer into tight contact with a substrate and bonding the adhesive layer to the substrate; and a metal electrode transferring step of transferring the adhesive layer and the plurality of metal electrodes onto the substrate by peeling the retaining sheet off from the plurality of metal electrodes.