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Invention Publication
CN103619136A 一种电子产品陶瓷壳体的叠层结构及其形成方法 无效 - 驳回

一种电子产品陶瓷壳体的叠层结构及其形成方法
Abstract:
一种电子产品陶瓷壳体的叠层结构的形成方法包括：S1、制备陶瓷层；S2、将天线辐射体层叠加在陶瓷层一侧；S3、通过烧结、热压或粘合的方式将陶瓷层与天线辐射体层结合。或者：S1、制备陶瓷层、一层或多层韧性材料层；S2、将一层或多层韧性材料层叠加在陶瓷层一侧，将天线辐射体层叠加在一层或多层韧性材料层上；S3、通过烧结、热压或粘合的方式将陶瓷层与天线辐射体层结合。一种电子产品陶瓷壳体的叠层结构，包括：陶瓷层；天线辐射体层，叠加在陶瓷层一侧；陶瓷层及天线辐射体层通过烧结、热压或粘合的方式结合。
Abstract(English):

A method for forming a laminated structure of an electronic product ceramic shell comprises the steps of S1, preparing a ceramic layer, S2, laminating an antenna radiator layer on one side of the ceramic layer, and S3, combining the ceramic layer and the antenna radiation layer in a sintering or hot-press or bonding mode; or S1, preparing the ceramic layer and one or more toughness material layers, S2, laminating the one or more toughness material layers on one side of the ceramic layer, laminating the antenna radiation layer on the one or more toughness material layers, and S3, combining the ceramic layer and the antenna radiator layer in the sintering or hot-press or bonding mode. The laminating structure of the electronic product ceramic shell comprises the ceramic layer and the antenna radiation layer, wherein the ceramic layer and the antenna radiation layer are laminated on one side of the ceramic layer, and the ceramic layer and the antenna radiation layer are combined in the sintering or hot-press or bonding mode.

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