An exemplary mold is disclosed for impregnating a prefabricated condenser core (C) of a high voltage bushing with a liquid resin and includes two mold modules movable against each other and shaped to form an axially symmetric mold cavity. The mold forms a column of cylindrical design, in which the at least two mold modules are arranged on top of each other. A first of the two mold modules can be executed as a hollow cylinder. Two opposing front faces of the two mold modules and a circular O-ring arranged between the two opposing front faces form a first sealing interface of the metal mold. Such a mold can have a very efficient sealing system and allow high pressures to be applied to the liquid resin and a beneficial forming of the condenser core in a device in which the resin is cured according to a specified temperature profile.