The present invention relates to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate (102) and a plurality of signal lead pairs (104, 120) to be coupled between said electronic unit (108, 116) and a front end contact region (106) for electrically contacting said interconnect structure by said further electronic component. A ground plane layer (118) is electrically insulated from said pairs of signal leads (104, 120), wherein each pair of signal leads (104, 120) has a circuit connecting region (122) for electrically contacting respective terminals of said at least one electronic unit (108, 116), and wherein in a region adjacent to said terminals of said at least one electronic unit (108, 116) said ground plane layer (118) has a plurality of clearances (126) that are each allocated to one pair of signal leads (104, 120) and separated from a respective neighboring clearance.