The present invention is related to a photosensitive resin composition. The following photosensitive resin composition has excellent photo-sensibility and developing performance and is capable of forming patterns with excellent mechanical physical properties and adhesion by comprising an alkali-soluble resin (A) including a first resin having repeating units represented by chemical formula 1 and 2, and a second resin having repeating units represented by chemical formula 3, a polymerizable compound (B), a polymerization initiator (C), and a solvent (D).