The invention discloses adhesive used for a semiconductor component organic film. The adhesive comprises polyalkoxysilane with a coupling function and solvent, polyalkoxysilane has a silicon hydroxyl group, and the solvent is composed of 1-methoxy-2-propyl alcohol, 3-aminopropyl silanetriol and 2-methoxy-1-propyl alcohol; according to the adhesive used for the semiconductor component organic film, polyalkoxysilane having the adhesion function is fully hydrolyzed, little low polymer is generated during hydrolysis, the adhesive is good in adhesion effect when used for adhering to an organic base material and an inorganic base material, and a coating layer on the surface of the inorganic base material is prevented from warping or falling; the adhesive is particularly suitable for small-size electronic components with intensive and complex surface graphs.