The invention relates to a negative photosensitive resin composition which includes alkali soluble resin including epoxy groups or oxygen heterocyclic butyl alkyl, a novolac low polymer curing agent with epoxy groups, and a polyfunctional thiol compound. The negative photosensitive resin composition can manufacture patterns which has substantially improved chemical resistance and excellent sealing force even after etching agent processing, and does not generate surface damage or film contraction.