The invention discloses a semiconductor component which comprises a middle layer base plate comprising a front side and a back side, a rerouting layer is arranged on the front side and comprises a plurality of contact pads, a plurality of lugs which is respectively arranged on the contact pads, at least one semiconductor chip which is arranged on the front side and is electrically connected with the rerouting layer through the lugs, a wraping restran cover is arranged on the front side to cover and seal the semiconductor chip, and a plurality of through-silicon vias which pass through the middle layer base plate and are electrically connected with the rerouting layer.