An image pickup module includes a frame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Each of the image pickup devices is adhered to an inner edge of one of the image pickup openings through one of the affixing gel layers, so as to affix the image pickup devices to the frame. A manufacture method of an image pickup module is also provided.