A piezoelectric vibration module includes external electrodes arranged in a stack direction on the outside surface of a piezoelectric device so that the state in which the piezoelectric device is coupled to the terminals of an FPCB can be reliably maintained even in a piezoelectric device bending phenomenon dependent on the repetition of contraction and/or expansion of the piezoelectric device. A portion in which the external electrodes of the piezoelectric device come in contact with the FPCB may be placed in a portion having small displacement.