The invention provides a negative-type photosensitive resin composition. The negative-type photosensitive resin composition comprises first alkali-soluble resin containing a specific repeating unit; second alkali-soluble resin containing a specific repeating unit; a polymerized compound; a photopolymerization initiator; and a solvent, thereby representing excellent patterning capability in photolithography and forming patterns with excellent mechanical performance, durability and adhesion to a bottom substrate.