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Invention Publication
CN106510913A 用于将聚合物支架压接至球囊的方法 有权

用于将聚合物支架压接至球囊的方法
Abstract:
一种用于将聚合物支架压接至球囊的方法，包括：将具有第一直径的支架置于支承球囊上；使所述支承球囊膨胀至用于在所述支架被压接的同时支承和稳定处于第一直径的所述支架的压力；在所述第一球囊由所述支承球囊支承的同时，将所述支架从所述第一直径压接至第二直径；在所述支架被减小至所述第二直径之后，使用球囊导管代替所述支承球囊；以及在所述支架被支承在所述球囊导管上的同时，将所述支架压接至比所述第二直径小的第三直径。
Abstract(English):

The invention discloses a method of crimping a composition support to sacculus. The method comprises steps that a support having a first diameter is disposed on a supporting sacculus; the sacculus is expanded to be used to support and stabilize pressure on the support having the first diameter, when the support is in a crimping connection; when a first sacculus is supported by the supporting sacculus, the support is crimped from the first diameter to a second diameter; when the support is reduced to the second diameter, a sacculus conduit is used to replace the supporting sacculus; when the support is supported on the sacculus conduit, the support is crimped to a third diameter smaller than the second diameter.

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