The present invention discloses a circuit board. The circuit board comprises a circuit board main body, a plurality of bonding pads and an insulation layer. The bonding pads and the insulation layer are arranged at the circuit board main body; each bonding pad comprises a first surface and a second surface; the first surface is patched to the circuit board main body; the second surface comprises a bonding area, a first extension area and a second extension area; the bonding area is located between the first extension area and the second extension area; the positions, corresponding to the bonding pads, of the insulation layer are provided with windows to expose the bonding area of the second surface of each bonding pad and the gaps between the bonding areas; and the insulation layer covers the first extension area and the second extension area. The circuit board can avoid the exposure of the wires connected with the bonding pads and prevent the bonding pads from falling off.