Disclosed is a manufacturing method for high-conductivity and thick-film aluminum paste. The manufacturing method at least comprises the following steps of providing aluminum powder comprising different grain diameters, wherein the ratio of big grain diameters to small grain diameters of the aluminum powder is (4 plus or minus 50%) to (1 plus or minus 50%); next, mixing the aluminum powder with glass powder, wherein the solid content of the glass powder is 7.5wt% plus or minus 50%, and total solid content ratio of the aluminum powder to the glass powder is 10 to 1; and finally performing liquid phase sintering on the mixture of the aluminum powder and the glass powder at a sintering temperature of at least 500 DEG C or above. By virtue of the sintering temperature, the aluminum powder in the mixture can be matched with the liquid phase glass powder based on a surface aluminium oxide cracking mechanism to coat all cracked surfaces of the aluminium powder in order to suppress a condition that bare liquid-state metal aluminum is in contact with air to be oxidized, and to promote adjacent bare liquid-state metal aluminum to be in mutual contact to form a conductive patch, so as to obtain consistent, dense and non-shrinkage thick-film conductive paste.