The invention discloses a photosensitive resin composition. The photosensitive resin composition is prepared from the following components in parts by weight: 10 to 30 parts of an alkali solubility amino acrylic polymer A, 5 to 15 parts of an unsaturated urethane acrylate polymer B with multifunctional groups, 1 to 5 parts of an acrylic ester monomer C, 1 to 5 parts of a photoinitiator D and 30 to 80 parts of an organic solvent E. The photosensitive resin composition disclosed by the invention can be used for low-temperature curing, and is high in insulation performance, chemical resistance, adhesive force and the like; moreover, a high-fineness pattern requirement can be met by a pattern formed by the photosensitive resin composition; and meanwhile, the photosensitive resin composition is low in high-temperature gas release and also can be used for high-temperature curing. The photosensitive resin composition is mainly used in the technical field of ultraviolet light curing and the fields of liquid crystal display manufacturing and capacitive touch screen manufacturing.