The invention concerns the field of microelectronics and relates to a compact capacitor, which can be used, for example, in high-frequency oscillating circuits and in high-frequency filters. The problem addressed by the invention is that of specifying a compact micro- or nanocapacitor that has reliable and simple contacting of the functional layers. This problem is solved by means of a method for producing a compact micro- or nanocapacitor, in which method a layer stack consisting of at least two functional layers and two layers of a two-dimensional material and consisting of at least two layers of an electrically insulating material is arranged on a substrate, and the at least two functional layers and the layers of a two-dimensional material are arranged protruding beyond the width of the layer stack transversely to the rolling direction on one side each alternately, and then the layer stack is rolled up and the protruding are integrally bonded to each other.