A wafer manufacturing method thereof is provided. The method includes a cutting step of supplying slurry to a moving metal array and lowering a holder holding a single crystal ingot relative to the metal array at the same time, thus cutting off the single crystal ingot; and a pulling step of pulling the cut-off single crystal ingot out of the metal array through raising the holder relative to the metal array. In the pulling step, the holder is raised relatively at a speed of 100 m/min or above.