The invention provides a multilayer printed circuit board (PCB). A welding disc array is arranged on the surface of the multilayer PCB, and comprises at least one welding disc unit, wherein each welding disc unit comprises a first welding disc and a second welding disc which are adjacent; and the first welding discs and the second welding discs are connected with first Z-direction transmission lines located in Z-direction grooves. Therefore, when signal lines located on signal layers of the multilayer PCB are arranged, the quantity of the to-be-avoided Z-direction grooves is less than the quantity of to-be-avoided holes in the prior art, that is to say, the difficulty of arrangement of the signal lines is reduced to a certain extent. In addition, the invention further provides corresponding communication equipment.