The invention relates to a device for adjusting magnetron sputtering film plating uniformity. The device comprises a rotary large drum and a vertical sputtering target, wherein the vertical sputtering target is arranged on the outer side of the rotary large drum, and is positioned on the same plane with the rotating axis of the rotary large drum; and the vertical sputtering target consists of an uniformity baffle plate, a metal target, a circuit and a target cooling system. The device has the following advantages: 1) the film plating precision is improved; and the film plating process is stable and efficient; and 2) the cavity forming treatment is not needed to reduce loss.