The present invention provides a pie-shaped semiconductor packaging structure and a combination thereof with a susceptor. The packaging structure includes a pie-shaped circuit substrate, a chip, and a pie-shaped packaging gel. The cake-shaped circuit substrate includes a first surface and a second surface opposite to the first surface, a sidewall connecting the first surface and the second surface, a plurality of external contacts, and a magnetic conductive portion. The external contacts are located on the second surface, and the magnetic conducting portions are disposed in the circular cake-shaped circuit substrate adjacent to the side walls. The magnetic conducting portions correspond to the external contacts. The chip is disposed on the first surface and electrically connected to the pie cake circuit board. The cake-shaped encapsulant is disposed on the first surface and covers the chip. The magnetic conductive portion of the donut-shaped semiconductor package structure of the present invention can correspond to a specific external contact point and can not move or rotate arbitrarily within the tray recess of the tray, thereby preventing the disk-shaped semiconductor package structure from colliding with the tray to cause damage.