A removal method of a PCB electroplating lead is used for removing an excess electroplating lead on a PCB and comprises a step (1) of providing a PCB on which a copper layer, a pad, a gold finger, animpedance line and an electroplating lead are arranged, wherein the electroplating lead and the pad are both provided with a solder mask protection layer on the outer sides; a step (2) of opening a window in the solder mask protection layer; a step (3) of selecting plating ink; a step (4) of performing pad surface treatment; a step (5) of removing a film; and a step (6) of etching to remove the lead. The beneficial effects of the invention are that the un-removed lead at one end of the pad in the subsequent procedure is made shorter and electrical parameters of the gold finger are more stableby providing the convex window; and the shortcoming of failing to cover the sidewall of the lead can be avoided and the film removal is facilitated by covering the lead with the selected plating ink;the residue of the lead can be reduced by using the etching method to remove the lead; and the removal method is highly practical and has a great significance in popularization.