The invention relates to the field of circuit boards and particularly discloses a circuit board processing method. A cutting device is adopted in the method and can cut a copper-clad plate, meanwhilecan also grind a cut cross section, can effectively reduce metal chippings or glass fiber chippings attached to the cross section, can reduce the possibility that the copper-clad plate is scratched and can fully ensure the quality of a finally obtained round copper-clad plate.