The invention relates to solder wire preparation equipment, in particular to a solder wire preparation machine. The solder wire preparation machine comprises a rosin treatment mechanism, an extrusionmechanism and a rosin pen communicating with the rosin treatment mechanism and the extrusion mechanism. The extrusion mechanism comprises a hydraulic cylinder for providing extrusion power, an extrusion rod for extruding a solder column and a solder wire mold for generating a solder wire; the rosin pen communicates with the solder wire mold; the rosin treatment mechanism comprises a fusion cylinder used for fusing rosin at a high temperature, an externally-connected tank communicating with the fusion cylinder, two liquid through pipes, one air through pipe, an internally-connected tank communicating with the rosin pen, and an air pump; the bottom of the fusion cylinder communicates with the bottom of the externally-connected tank through one liquid through pipe; the bottom of the externally-connected tank communicates with the bottom of the internally-connected tank through one liquid through pipe; an extraction opening of the air pump communicates with the top of the externally-connected tank; an air outlet of the air pump communicates with the top of the internally-connected tank; and an extraction opening is formed in the top of the externally-connected tank. The solder wire preparation machine can prepare the solder wire not provided with a hollow cavity.