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CN107863447B 制备OLED薄膜封装层的方法、OLED薄膜封装结构及OLED结构 有权

制备OLED薄膜封装层的方法、OLED薄膜封装结构及OLED结构
Abstract:
本发明实施例公开了一种制备OLED薄膜封装层方法，包括步骤：在设置有OLED器件的基板上沉积第一无机材料膜层，所述第一无机材料膜层完全覆盖所述OLED器件；在所述第一无机材料膜层上通过等离子体增强化学气相沉积法工艺沉积第一有机材料膜层；在所述第一有机材料膜层上通过喷墨打印工艺沉积第二有机材料膜层；在所述第二有机材料膜层上沉积第二无机材料膜层。本发明还公开了相应的OLED薄膜封装结构以及OLED结构。实施本发明实施例，可以减小OLED薄膜封装层的厚度。
Abstract(English):

A method of manufacture OLED thin-film encapsulation layer, an OLED thin-film encapsulation structure and an OLED structure are provided. The method of manufacture OLED thin-film encapsulation layer comprises following steps. Depositing a first inorganic material layer on a substrate positioning an OLED element, the first inorganic material layer is totally covered the OLED element; Depositing a first organic material layer on the first inorganic material layer by PECVD process; Depositing a second organic material layer on the first organic material layer by IJP process; Depositing a second inorganic material layer on the second organic material layer. The advantageous of this disclosure could decreases thickness of the OLED thin-film encapsulation layer.

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