The invention discloses a thick and thin material chip-free punching structure applied to a stamping forming type wire frame. The structure comprises a chip-free punching punch and a chip discharginghole, wherein the chip-free punching punch is arranged on an upper module, and the chip discharging hole is formed in a lower module, is located on the lower side of the chip-free punching punch and is matched with the chip-free punching punch so as to discharge waste chips punched by the chip-free punching punch. The chip-free punching punch is provided with a punching flange protruding towards the inner side of the chip-free punching punch, when the chip-free punching punch is used to punch cavities at the front side and the rear side of a drainage ditch, the punching flange punches the waste chips extruded from the side wall of the upper part of the drainage ditch to the side wall of the lower part of the drainage ditch, so that the waste chips are completely cut off, and the purpose ofcutting thick and thin material without chips is achieved; the wire frame which is punched and formed by using the thick and thin material chip-free punching structure applied to the stamping formingtype wire frame reaches the qualified standard, so that the qualified rate of the wire frame is greatly improved, production efficiency is greatly improved, production progress of a production enterprise is accelerated, the increasingly tense demand is met, and meanwhile, further development of the information technology is facilitated.