The invention relates to the field of etching, and specifically relates to a selective silver etching solution. The etching solution contains peroxysulphate, 2-sulfydryl-1-methylimidazole, water, sulfuric acid or phosphoric acid, has relatively high etching rate for metallic silver, and is little in corrosion for copper; the ratio of the rate for etching silver to the rate for corroding copper canreach 6 to 9 times, and no etching residue can be generated in the etching process, so that the etching solution is always clear and transparent. The etching solution is stable in performance, and the etching solution still can stay the same after being stored for two months, so that the etching solution has important application values.