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Invention Grant
CN108559947B 掩膜板、掩膜组件及掩膜板制作方法 有权

掩膜板、掩膜组件及掩膜板制作方法
Abstract:
本发明涉及一种掩膜板、掩膜组件及掩膜板制作方法，该掩膜板用于张紧焊接于支撑框架上，掩膜板为电铸掩膜板，掩膜板包括蒸镀区、非蒸镀区和用于与支撑框架焊接的焊接区，至少在焊接区内掺杂有辅助离子，以提高焊接区的焊接性能，辅助离子的焊接性能优于制作掩膜板用电铸液中的抗腐蚀离子的焊接性能。上述掩膜板中，至少在焊接区内掺杂辅助离子，以提高焊接区的焊接性能，辅助离子的焊接性能优于制作掩膜板用电铸液中抗腐蚀离子的焊接性能。由于辅助离子的焊接性能较好，将辅助离子掺杂到焊接区内后，提高和焊接内焊接性能较好的离子的含量，进而提高了焊接区的焊接性能，保证掩膜板与支撑框架的焊接效果。
Abstract(English):

Disclosed is a mask plate (100) to be tensioned and welded onto a support frame (10), the mask plate (100) is an electroforming mask plate, and the mask plate (100) comprises an evaporation area (20), a non-evaporation area (40), and a welding area (60) for welding with the support frame (10), wherein magnetic metal ions are doped at least in the welding area (60) to improve the welding performance of the welding area (60). Further disclosed are a mask assembly and a method for manufacturing the mask plate.

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