The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode electroplating treatment system. The semiconductor diode electroplating treatment system comprises a top plate, an electroplating bath, a supporting column, an electroplating tank, a drive module and a stirring module; the drive module comprises a first motor, a first cam, a first sliding telescopic rod, a first sliding block, and a second sliding block, through cooperation of the first cam, the first sliding block and the first sliding telescopic rod, the electroplating tank swings while descending, electroplating liquid makes sufficient contact with the semiconductor diode, a third sliding block plugs a first liquid inlet in the right side, the electroplatingliquid enters from the first liquid inlet in the left side of a bottom plate of a tank body and impacts a fourth plate, a supporting disc on the fourth plate shakes, the electroplating liquid enters the electroplating tank, through vibration of a vibration frame, the semiconductor diode vibrates, the contact area between the electroplating liquid and the semiconductor diode can be increased, and the electroplating efficiency and the quality of the semiconductor diode are improved.