The present invention provides a component mounting device capable of accurately delivering an axial component to a mounting head and a method of manufacturing a component-mounted substrate using thesame. A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die configured to come into contact from below with two leads, the two leads having a spring property and extending laterally from a body of an axial component, to lift the leads in a bent state; a fixed forming-die disposed outside the movable forming-die to guide a movement of the leads in the bent state from the outside; a mounting head configured to be disposed above the fixed forming-die, the mounting head having a pair of claws configured to sandwich and clamp from bothsides the leads in the bent state lifted by the movable forming-die, the mounting head being movable to insert the clamped leads into a substrate; and a distance adjustment portion configured to adjust a distance between the two claws of the mounting head, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mountinghead the distance between the claws is larger than a distance of the fixed forming-die.