A temperature-controlled adhesion type Micro-LED mass transfer method comprises the steps of: A, setting a self-assembly structure, wherein one surface of a wafer is processed with a positive electrode pin and a negative electrode pin, the other surface is processed with a self-assembled microstructure, a transfer substrate is processed with a self-carrying microstructure, the self-assembled microstructure and the self-carrying microstructure are assembled with each other, and the surface of the self-carrying microstructure is coated with a temperature-controlled adhesive layer; B, starting the self-assembly operation, wherein the self-assembly operation is implemented by using a container to hold water, dispersing the wafers into the water, immersing the transfer substrate in water, raising the temperature of the water by means of a heating device, and stirring the water by using a stirrer; C, and starting the transfer operation, wherein the transfer operation is implemented by stopping the heating and stirring of the water, taking out the transfer substrate, and immersing a target substrate in high temperature water, placing the transfer substrate in high temperature water to bealigned with the target substrate, and lowering the temperature of the water, so that a Micro-LED wafer is separated from the transfer substrate and falls onto the target substrate. The temperature-controlled adhesion type Micro-LED mass transfer method adopts a physical principle for transfer, and does not affect the wafers themselves.