Invention Grant
- Patent Title: 一种附着式电阻应变传感器总成及其安装工艺
-
Application No.: CN201910403186.8Application Date: 2019-05-15
-
Publication No.: CN110118524BPublication Date: 2022-02-25
- Inventor: 胡天旭 , 胡光良
- Applicant: 胡天旭
- Applicant Address: 浙江省杭州市上城区天福花园5幢2单元501室
- Assignee: 胡天旭
- Current Assignee: 胡天旭
- Current Assignee Address: 浙江省杭州市上城区天福花园5幢2单元501室
- Agency: 北京睿智保诚专利代理事务所
- Agent 周新楣
- Main IPC: G01B7/16
- IPC: G01B7/16
Public/Granted literature
- CN110118524A 一种附着式电阻应变传感器总成及其安装工艺 Public/Granted day:2019-08-13
Information query
