刮膜装置及刮膜方法

Invention Publication

CN110120330A 刮膜装置及刮膜方法有权

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Patent Title: 刮膜装置及刮膜方法
Patent Title (English): Film scraping device and film scraping method
Application No.: CN201810122367.9

Application Date: 2018-02-07
Publication No.: CN110120330A

Publication Date: 2019-08-13
Inventor: 卢芳万
Applicant: 奇景光电股份有限公司
Applicant Address: 中国台湾台南市
Assignee: 奇景光电股份有限公司
Current Assignee: 奇景光电股份有限公司
Current Assignee Address: 中国台湾台南市
Agency: 永新专利商标代理有限公司
Agent 蔡洪贵
Main IPC: H01L21/02
IPC: H01L21/02 ; H01L21/67 ; H01L21/677 ; H01L21/683

Abstract:

一种刮膜装置，包括一承载机构、一传动机构以及一刮膜机构。传动机构耦接承载机构以带动承载机构旋转。刮膜机构配置于承载机构的一侧。当具有一残胶的一晶圆置放于承载机构上，且刮膜机构抵接残胶时，传动机构带动承载机构旋转，以使刮膜机构与晶圆相对移动而刮除残胶。

Abstract(English):

A film scraping device comprises a bearing mechanism, a transmission mechanism and a film scraping mechanism. The transmission mechanism is coupled to the bearing mechanism to drive the bearing mechanism to rotate. The film scraping mechanism is arranged on one side of the bearing mechanism. When a wafer with residual glue is placed on the bearing mechanism and the film scraping mechanism abuts against the residual glue, the transmission mechanism drives the bearing mechanism to rotate, so that the film scraping mechanism and the wafer move relatively to scrape the residual glue.

Public/Granted literature

CN110120330B 刮膜装置及刮膜方法 Public/Granted day:2021-05-25

Information query

Chinese Patent Announcement Global Dossier Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理