A semiconductor device for electric power is provided with: a ceramic substrate (2); a semiconductor element (3) for electric power wherein electrodes (for example 3a, 3e) are formed on one surface and the other surface is joined to the ceramic substrate (2); a lead terminal (62) one end side of which is joined to the electrodes and the other end side of which is electrically connected externally;and a sealing body (7) for sealing the semiconductor element (3) for electric power along with parts of the lead terminal (62) joined to the electrodes. A surface (62t) inclined away from the ceramicsubstrate (2) as it goes to an end part (62e) is formed on the end part (62e) on the one end side of the lead terminal (62).