The invention relates to a no-pin module, and the module comprises a substrate which is provided with a first surface, a second surface and a side surface connected between the first surface and the second surface, wherein an obtuse angle is formed between the side surface and the first surface. Grooves corresponding to the side faces are formed in the substrate at intervals, and conductive layersare plated on the inner walls of the grooves. A first bonding pad is printed at the periphery of one end, corresponding to the groove, of the first surface; a second bonding pad is printed at the periphery of the other end, corresponding to the groove, of the second surface; and the first bonding pad and the second bonding pad are both connected with the conducting layer. The no-pin module is simple in structure and reasonable in design, and the side face and the first surface are obliquely arranged. Moreover, the angle formed between the side face and the first surface is the obtuse angle, so that the thickness of the joint of the first bonding pad and the conductive layer is reduced, and the impedance discontinuity degree can be effectively reduced. Meanwhile, the side face is providedwith the groove, and the tin climbing effect can be improved.