The invention discloses an imaging device, a camera module and a manufacturing method. The imaging device includes: an image sensor chip (100) comprising a chip photosensitive surface (101) and a chipbottom surface (102) opposite to the chip photosensitive surface (101), wherein the chip photosensitive surface (101) comprises a chip photosensitive area (110), a peripheral transition area (120) surrounding the chip photosensitive area and an input/output wiring area (130) surrounding the peripheral transition area (120), and at least one input/output wiring board (131) is arranged in the input/output wiring area (130); a selective filtering covering plate (210) which is arranged above the chip photosensitive area (110); an enclosing wall body (220) arranged in the peripheral transition area (120) and jointed with the selective filtering covering plate (210) to form a closed cavity (230); and an out-of-chip guide wire (250), wherein one end of the out-of-chip guide wire (250) is connected with the input/output wiring board (131), and the other end of the out-of-chip guide wire (250) extends out of the image sensor chip (100). The imaging device can prevent tiny dust or other foreignmatters from falling into the chip photosensitive area to influence the photosensitive and imaging functions.