The invention discloses a method for manufacturing a mechanical blind half hole, and the method comprises the following steps: drilling a blind hole at the edge of a unit plate area on a production board, wherein a half of the blind hole is located in a forming line area on the production plate; drilling a through hole with the same aperture as the blind hole in the forming line area beside the blind hole, wherein the through hole is intersected with the blind hole; metalizing the hole through the processes of copper deposition and full-board electroplating; manufacturing an outer-layer circuit on the production board, firstly milling off the forming line area beside the blind hole in the production board in the process of manufacturing the outer-layer circuit after pattern electroplating,and then performing outer-layer etching to obtain the outer-layer circuit and the metalized blind half-hole. According to the invention, the risk that the bottoms of the blind hole semi-holes are free of copper can be effectively solved through the optimization of the production process, the problems of shawl and burrs on the edges of the blind hole semi-holes can be avoided, and the quality of circuit board products is guaranteed.