The invention provides a printed circuit board and a processing method thereof. The processing method of the printed circuit board comprises the following steps: providing a first conductive layer, asecond conductive layer, a base material layer and a through hole; the base material layer is clamped between the first conductive layer and the second conductive layer; the through hole sequentiallypenetrates through the first conductive layer, the base material layer and the second conductive layer; a conductive layer is arranged on the surface of the inner side of the through hole; and the first conductive layer and the second conductive layer are electrically connected through the conductive layer. Compared with the prior art, by use of the processing method of the printed circuit board,the problem that electroplating salient points appear on the surface of a product during hole electroplating can be effectively solved; and the printed circuit board does not need to be polished during lamination, so that the defects caused by polishing are reduced, the production and manufacturing time is reduced, and the product quality is improved.