A thermally conductive resin molded article including a resin and a thermally conductive filler that includes a first thermally conductive filler and a second thermally conductive filler having a smaller grain size than the first thermally conductive filler, wherein the thermally conductive filler content is 30-50% by volume, the first thermally conductive filler comprises boron nitride having a grain size of 30 μm or greater and an aspect ratio of 10 or higher, the first thermally conductive foller content is 5-20% by volume, and the second thermally conductive filler comprises a material other than boron nitride.