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Invention Publication
CN111052884A 包括焊接在埋入式焊盘上的SMD的电子板 有权

包括焊接在埋入式焊盘上的SMD的电子板
Abstract:
本发明涉及一种用于制造(S)电子板(1)的方法(S)，该方法包括以下步骤：在导电表层(C1)和下面的绝缘层(10)中形成(S1，S4)空腔(20)，使得焊盘(4)的至少一部分被暴露，用焊膏(24)填充(S5)空腔(20)，将SMD(3)相对于空腔(20)放置(S6)，将SMD(3)焊接至电子板(1)上。
Abstract(English):

The invention relates to a method (S) for manufacturing an electronic board (1) comprising the following steps: - forming (S1, S4) a cavity (20) in the conductive skin layer (Ci) and in an underlying insulating layer (10), such that at least a portion of a solder pad (4) is exposed, - filling (S5) the cavity (20) with a solder paste (24), - positioning (S6) an SMD (3) opposite the cavity (20), - and soldering the SMD (3) on the electronic board (1).

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