Invention Publication
- Patent Title: ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE COMPRISING SAID ELECTRONIC DEVICE HOUSING AND METHOD OF ASSEMBLING SAID ELECTRONIC DEVICE
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Application No.: EP24155862.6Application Date: 2011-11-02
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Publication No.: EP4340147A2Publication Date: 2024-03-20
- Inventor: PAKULA, David , LYNCH, Stephen Brian , DINH, Richard Hung Minh , TAN, Tang Yew , TAN, Lee Hua
- Applicant: Apple Inc.
- Applicant Address: US Cupertino, CA 95014 One Apple Park Way
- Agency: Rooney, John-Paul
- Priority: US94467110 20101111
- Main IPC: H02G11/02
- IPC: H02G11/02
Abstract:
An electronic device comprising a support structure defining a first portion of an exterior surface of the electronic device, and an outer housing member. The outer housing member defines a second portion of the exterior surface and an inner surface of the outer housing member. The electronic device further comprises a protective element coupled to the support structure and formed from a polymer material that is molded to the outer housing member and is secured to the inner surface of the outer housing member.
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