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Invention Patent
JP2021000828A 低誘電接着剤層を含有する積層体 有权

低誘電接着剤層を含有する積層体
Abstract:
【課題】従来のポリイミド、ポリエステルフィルムだけでなく、LCPなどの低極性樹脂基材や金属基材と高い接着性を有し、高いハンダ耐熱性を得ることができ、且つ低誘電特性に優れる積層体の提供。 【解決手段】カルボキシル基含有ポリオレフィン樹脂(A)、カルボキシル基含有スチレン樹脂(B)、カルボジイミド樹脂(C)およびエポキシ樹脂(D)を含む接着剤層を介して樹脂基材および金属基材が積層された積層体(Z)であって、(1)接着剤層の周波数1MHzにおける比誘電率(ε c )が3.0以下であり、(2)接着剤層の周波数1MHzにおける誘電正接(tanδ)が0.02以下であり、(3)樹脂基材をLCP基材とした場合のLCP基材と金属基材との剥離強度が0.8N/mm以上であり、(4)積層体(Z)の加湿ハンダ耐熱性が240℃以上である積層体(Z)。 【選択図】なし
Abstract(English):

To provide a laminate which has high adhesive property not only to conventional polyimide and polyester films but also to a low polarity resin base material such as an LCP and to a metal base material, with which high solder heat resistance can be obtained, and which is excellent in low dielectric characteristics.SOLUTION: A laminate (Z) comprises a resin base material and a metal base material laminated to each other via an adhesive layer including a carboxy group-containing polyolefin resin (A), a carboxy group-containing styrene resin (B), a carbodiimide resin (C), and an epoxy resin (D), in which (1) a relative dielectric constant (εc) of the adhesive layer at a frequency of 1 MHz is 3.0 or less, (2) dielectric loss tangent (tanδ) of the adhesive layer at a frequency of 1 MHz is 0.02 or less, (3) in the case of an LCP base material being specified as the resin base material, peel strength between the LCP base material and the metal base material is 0.8 N/mm or more, and (4) solder heat resistance during humidification of the laminate (Z) is 240°C or more.SELECTED DRAWING: None

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