Invention Patent
- Patent Title: Method for producing a molded product electroless plating has been applied
-
Application No.: JP2007131942Application Date: 2007-05-17
-
Publication No.: JP5199606B2Publication Date: 2013-05-15
- Inventor: 佳子 北村 , 孝司 清水 , 哲司 太田
- Applicant: 株式会社きもと
- Assignee: 株式会社きもと
- Current Assignee: 株式会社きもと
- Priority: JP2007131942 2007-05-17
- Main IPC: C23C18/30
- IPC: C23C18/30
Public/Granted literature
- JP2008285723A Method for producing molding subjected to electroless plating Public/Granted day:2008-11-27
Information query
IPC分类: