Invention Grant
- Patent Title: MEMS microphone
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Application No.: US15119878Application Date: 2015-06-25
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Publication No.: US10003890B2Publication Date: 2018-06-19
- Inventor: Yonggang Hu
- Applicant: CSMC TECHNOLOGIES FAB1 CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: CSMC TECHNOLOGIES FAB1 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB1 CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: CN201410376030 20140801
- International Application: PCT/CN2015/082285 WO 20150625
- International Announcement: WO2016/015530 WO 20160204
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R7/14 ; H04R7/12 ; B81B3/00 ; H04R7/16

Abstract:
A MEMS microphone includes a substrate (100), a supporting part (200), an upper polar plate (300) and a lower polar plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower polar plate (400) straddles the opening (120); the supporting part (200) is fixed on the lower polar plate (400); the upper polar plate (300) is affixed to the supporting part (200); an accommodating cavity (500) is formed among the supporting part (200), the upper polar plate (300) and the lower polar plate (400); a recess (600) opposite to the accommodating cavity (500) is arranged in an intermediate region of at least one of the upper polar plate (300) and the lower polar plate (400), and insulation is achieved between the upper polar plate (300) and a lower polar plate (400).
Public/Granted literature
- US20170070824A1 MEMS MICROPHONE Public/Granted day:2017-03-09
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