Invention Grant
- Patent Title: Potting material for membrane modules and hollow fiber membrane module using same
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Application No.: US15315121Application Date: 2015-06-02
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Publication No.: US10005041B2Publication Date: 2018-06-26
- Inventor: Yoshie Tanizaki , Ayumi Tanaka , Masakazu Minagawa , Kana Inoue
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2014-115973 20140604; JP2015-085576 20150420
- International Application: PCT/JP2015/065911 WO 20150602
- International Announcement: WO2015/186705 WO 20151210
- Main IPC: B01D53/22
- IPC: B01D53/22 ; B01D69/08 ; B01D69/10 ; B01D69/12 ; B01D63/00 ; B01D63/02
Abstract:
A potting material for membrane modules which is formed of an epoxy resin composition, in which the mass change ratio of a cured product of the epoxy resin composition after being immersed in diethylene glycol methyl ethyl ether at 40° C. for one week is ±10% or less, and the mass change ratio thereof after being immersed in tetrahydrofurfuryl acrylate at 40° C. for one week is ±5% or less, and a hollow fiber membrane module which uses the potting material for membrane modules.
Public/Granted literature
- US20170189860A1 POTTING MATERIAL FOR MEMBRANE MODULES AND HOLLOW FIBER MEMBRANE MODULE USING SAME Public/Granted day:2017-07-06
Information query
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