Invention Grant
- Patent Title: Machining apparatus
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Application No.: US14392180Application Date: 2013-07-09
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Publication No.: US10005140B2Publication Date: 2018-06-26
- Inventor: Norio Tanaka
- Applicant: NIHON SHORYOKU KIKAI CO., LTD.
- Applicant Address: JP Isesaki-shi, Gunma
- Assignee: NIHON SHORYOKU KIKAI CO., LTD.
- Current Assignee: NIHON SHORYOKU KIKAI CO., LTD.
- Current Assignee Address: JP Isesaki-shi, Gunma
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- International Application: PCT/JP2013/068721 WO 20130709
- International Announcement: WO2015/004727 WO 20150115
- Main IPC: B23D79/02
- IPC: B23D79/02 ; B23Q3/18 ; B23C3/12 ; B23C3/00 ; B25J11/00 ; B23C5/10 ; B23C5/12

Abstract:
A machining apparatus capable of performing chamfering with high precision is provided. A machining unit 13 is provided at a distal end portion 12a of an arm 12 of an articulated robot 11, and the machining unit 13 includes a profiling roller 57, which serves as a roller that abuts against a part to be profiled Wd of a workpiece W, and a rotatable tool 41 having an axis line 41a having a distance between the rotatable tool 41 and the profiling roller 57 in conformity with a width of the workpiece W (width of a band-like portion Wc) and extending in parallel with an axis line 57a corresponding to a support axis of the profiling roller 57, and the rotatable tool 41 includes cutting blades 41b or blade portions 73 and 73 as chamfering blades.
Public/Granted literature
- US20160184905A1 MACHINING APPARATUS Public/Granted day:2016-06-30
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