Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US15548032Application Date: 2016-03-24
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Publication No.: US10005280B2Publication Date: 2018-06-26
- Inventor: Fumiya Takino , Shunsuke Watanabe , Kenta Anegawa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2015-064144 20150326; JP2016-020628 20160205
- International Application: PCT/JP2016/001720 WO 20160324
- International Announcement: WO2016/152166 WO 20160929
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A liquid ejecting head (100) includes a pressure chamber substrate (34) on which pressure chamber spaces (342) are formed; a flow path substrate (32) which includes a first face (F1) on which the pressure chamber substrate (34) is provided, and a second face (F2) on a side opposite to the first face (F1), and on which a space (R1), a supply hole (322) which causes the space (R1) and the pressure chamber space (342) to communicate, and a communicating hole (324) which communicates with the pressure chamber space (342) are formed; a nozzle plate (52) which is provided on the second face (F2), and on which nozzles (N) which communicate with the communicating hole (324) are formed; a housing (40) which is provided on the first face (F1), and in which a space (R2) which communicates with the space (R1) of the flow path substrate (32), and an opening portion (422) which communicates with the space (R2) are formed; a flexible compliance unit (54) which is provided on the second face (F2), and seals the communicating hole (324) and the space (R1); and a flexible compliance unit (46) which seals the opening portion (422).
Public/Granted literature
- US20180022097A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2018-01-25
Information query
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