Invention Grant
- Patent Title: Print module with air cooling arrangement
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Application No.: US15583031Application Date: 2017-05-01
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Publication No.: US10005299B2Publication Date: 2018-06-26
- Inventor: Mark Profaca , David Burke , Billy Sy , Gilbert Alemana , Christopher Hibbard , Rommel Balala
- Applicant: Memjet Technology Ltd.
- Applicant Address: IE
- Assignee: Memjet Technology Limited
- Current Assignee: Memjet Technology Limited
- Current Assignee Address: IE
- Agency: Cooley LLP
- Main IPC: B41J29/377
- IPC: B41J29/377 ; B41J25/304 ; B41J2/165 ; B41J2/045 ; B41J2/175 ; B41J25/34 ; B41J2/155 ; B41J25/00

Abstract:
A print module includes: a body housing first and second opposed printed circuit boards (PCBs), each of the first and second PCBs having heat-generating electronic components; an air inlet and an air outlet positioned towards an upper part of the body; an air pathway extending between the air inlet and the air outlet; a plurality of heatsinks, each heatsink being thermally coupled with one of the heat-generating components and having an array of cooling fins extending into the air pathway; and an inkjet printhead receiving power and print data from at least one of the first and second PCBs. The inkjet printhead is positioned toward a lower part of the print module.
Public/Granted literature
- US20170313109A1 PRINT MODULE WITH AIR COOLING ARRANGEMENT Public/Granted day:2017-11-02
Information query
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