Invention Grant
- Patent Title: Method of manufacturing pattern substrate and method of locating component
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Application No.: US14295753Application Date: 2014-06-04
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Publication No.: US10005663B2Publication Date: 2018-06-26
- Inventor: Naoki Yamamoto , Kanji Nakayama , Keita Saito , Dai Suwama
- Applicant: Konica Minolta, Inc.
- Applicant Address: JP Tokyo
- Assignee: KONICA MINOLTA, INC.
- Current Assignee: KONICA MINOLTA, INC.
- Current Assignee Address: JP Tokyo
- Agency: Lucas & Mercanti, LLP
- Priority: JP2013-121395 20130610
- Main IPC: G03G15/20
- IPC: G03G15/20 ; B81C3/00
Abstract:
There is provided a method of manufacturing a pattern substrate in which a pattern is formed on the surface of the substrate. The manufacturing method includes a step of preparing the substrate and a step of arranging a liquid-repellent or lyophilic material on the surface of the substrate so as to form the pattern on the surface of the substrate in which the surface of the substrate has a liquid-repellent region and a lyophilic region, the pattern is formed by one of the liquid-repellent region and the lyophilic region and the pattern is used to locate a component by the surface tension of a liquid member.
Public/Granted literature
- US20140360252A1 METHOD OF MANUFACTURING PATTERN SUBSTRATE AND METHOD OF LOCATING COMPONENT Public/Granted day:2014-12-11
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